IEEE 2026 NSS MIC RTSD

Online program Overview Session: WS-02

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 Total overview Day overview

Digital SiPM and SPAD-based sensors
 
Shortcut: WS-02
Date: Sunday, 8 November, 2026, 14:30 - 19:40
Location: ALBÉNIZ & MACHUCA
Session type: Workshops

Summary

Digital SiPMs and SPAD-based devices see increased development activity with the potential of improving photon-counting systems. The main NSS program reports on technology performance and application use of available technologies.

The goal of the workshop is to provide a place where upcoming/future technologies can be described by their developers, development roadmaps can be disclosed, and application niches or markets are aimed for.

This is not the type of communication easily accepted in the main program.

To make sure everyone is included, we invite groups who develop digital SPAD systems or have proposals to use this type of photodetectors to contact us for a participation in the workshop. 

Tentative topics for the workshop structure:

  • Roadmap presented by technology developers (short talks)
  • Discussion/debate on collaboration and funding strategies to bring these technologies to use

We will invite spin-offs that commercialize SPAD based detectors to attend the event and participate in the discussion/debate.

Contact

Serge Charlebois, Université de Sherbrooke, Canada (serge.charlebois@usherbrooke.ca)
Catherine Pepin, Université de Sherbrooke, Canada (catherine.pepin@usherbrooke.ca)
Stefan Gundacker, ÖAW, Austria (stefan.gundacker@oeaw.ac.at)
Claudio Bruschini, EPFL, Switzerland (claudio.bruschini@epfl.ch)
Fabrice Retière, TRIUMF, Canada (fretiere@triumf.ca)

Contents

Click on an contribution to preview the abstract content.

The underlined authors are the presenters. The authors in bold are the main authors.

14:30 WS-02-01

Opening words

14:40 - 16:00 - Topic 1 - Projets status
14:40 WS-02-02

Status of project DIGILOG (#3409)

S. Bisi1

1 École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland

Abstract

Please complete

Keywords: digital SiPM, SPAD
14:47 WS-02-03

Status of the PetVision project (#3410)

R. Dolenec1, 2, D. Gascon3, A. Gola4, J.M. B. Benlloch5, D. G. Sanchez6, R. Ballabriga7, W. Weber8, G. Elfakhri9, R. Pestotnik2

1 University of Ljubljana, Faculty of Mathematics and Physics, Ljubljana, Slovenia
2 Jožef Stefan Institute, Experimental Particle Physics Department, Ljubljana, Slovenia
3 University of Barcelona, Dept. Física Quàntica i Astrofísica, Institut de Ciències Del Cosmos, Barcelona, Spain
4 Fondazione Bruno Kessler, Trento, Italy
5 The Institute of Instrumentation for Molecular Imaging, Valencia, Spain
6 Oncovision, Valencia, Spain
7 European Organisation for Nuclear Research - CERN, Geneva, Switzerland
8 Technical University of Munich (TUM-MED), Munich, Germany
9 University of California Davis, Dept. of Biomedical Engineering, Davis, California, United States of America

Abstract

With coincidence timing resolution (CTR) below 100 ps positron emission tomography (PET) with limited angular coverage and even small flat panels could reach state-of-the-art image quality. The PetVision project is developing a novel modular PET detector concept based on high-resolution time-of-flight (TOF) capabilities that approach the physical limits of current scintillator technology.

Achieving this performance requires dedicated development and optimized integration of key PET detector components. We are designing a low noise, high dynamic range frontend electronics, specifically a next generation ASIC with 20 ps intrinsic time resolution and on-chip time-to-digital conversion (TDC). Concurrently, we are advancing SiPM sensor technology to enhance photon detection efficiency and reduce jitter. We also explore 2.5D integration between the photodetector and electronics to minimise parasitic effects and timing dispersion.

This contribution present the project’s vision and progress in technology development, focusing on the ASIC design, production of dedicated SiPMs and preliminary tests of 2.5D integration approaches.

AcknowledgmentThis project has received funding from the European Union’s Horizon Europe research and innovation programme under grant agreement No 101099896
Keywords: digital SiPM, SPAD, Time-of-flight PET, Coincidence Timing Resolution, Fast Timing ASICs
14:54 WS-02-04

Status of project GRAMS3D Sherbrooke (#3401)

S. A. Charlebois1

1 Université de Sherbrooke, Génie électrique et génie informatique, Institut interdisciplinaire d’innovation technologique (3IT, Sherbrooke, Québec, Canada

Abstract

Please complete.

Keywords: digital SiPM, SPAD
15:01 WS-02-05

Status of project at TRIUMF (#3411)

F. Retiere1

1 TRIUMF, Science Technology Department, Vancouver, British Columbia, Canada

Abstract

Please complete

Keywords: digital SiPM, SPAD
15:08 WS-02-06

Status of project Picopix (#3412)

R. Ballabriga1

1 Conseil européen pour la Recherche Nucléaire (CERN), Geneva, Switzerland

Abstract

Please complete

Keywords: digital SiPM, SPAD
15:15 WS-02-07

Recent progress in TSV, 2.5D and 3D integration of SiPMs at FBK (#3413)

A. Gola1

1 Fondazione Bruno Kessler (FBK), Trento, Italy

Abstract

FBK is developing a set of integration technologies to overcome the limits of wire-bonded, front-side-contacted SiPMs in large-area, high-granularity detectors. We report on the latest progress of our through-silicon-via (TSV) platform. A first run of a glass-less TSV process has been carried out alongside the standard front-side production flow, and the transfer of the process to an external foundry has been assessed. TSVs allow 6x6 mm2 SiPMs to be segmented into independently read sub-pixels down to 1 mm2 on the same die, and a single-cell-access TSV layout, giving back-side access to individual microcells, has been taped out. In parallel, we are pursuing 2.5D and 3D integration with front-end electronics, including 3D stacking of SiPMs on readout ASICs developed with an industrial partner. These approaches enable four-side tileable modules with minimal dead area, and aim at finer segmentation and improved timing for TOF-PET, high-energy physics and space applications.

Keywords: SiPM, through-silicon via, 2.5D integration, 3D integration, tileable photodetectors
15:22 WS-02-08

Status of project PLATON (#3414)

K. Kaneyasu1, 2, D. Sgalaberna1

1 ETH Zurich, Inst. f. Teilchen- und Astrophysik, Zürich, Switzerland
2 École Polytechnique Fédérale de Lausanne, Neuchâtel, Switzerland

Abstract

Please complete

Keywords: digital SiPM, SPAD
15:29 WS-02-09

Status of project ASPIDES (#3415)

T. Floris1

1 Universita di Pavia, Pavia, Italy

Abstract

Please complete

Keywords: digital SiPM, SPAD
15:36 WS-02-10

Status of project at University of Science and Technology of China (#3416)

N. D'Ascenzo1

1 University of Science and Technology of China, Department of Information Science and Technolog, Hefei, China

Abstract

Please complete

Keywords: digital SiPM, SPAD
15:43 WS-02-11

Status of project spadRICH (#3417)

P. Singh1, R. Dolenec2

1 École polytechnique fédérale de Lausanne, AQUA Laboratory, Neuchâtel, Switzerland
2 University of Ljubljana, Faculty of Mathematics and Physics, Ljubljana, Slovenia

Abstract

Please complete

Keywords: digital SiPM, SPAD

16:00 - 16:15 - Break

16:15 - 17:00 - Invited Talk - Digital SPAD detectors: a broader perspective on trends and markets
16:15 WS-02-12

Packing Functionality under SPADs with nanometer scale 3D Stacking Technologies (#3418)

R. K. Henderson1

1 University of Edinburgh, School of Engineering, Edinburgh, United Kingdom

Abstract

This talk will look at recent 3D stacked SPAD sensors and consider the limits of what electronics can be packed under SPAD detectors. In latest 3D stacked nanometer-scale SPAD technologies. We will consider examples of high resolution arrays for HDR intensity imaging, LIDAR arrays and computational pixels for life-science applications. The prospects for the nuclear science community to harness these largely consumer/automotive driven technologies will be discussed.

Keywords: SPAD, HDR intensity imaging, LIDAR arrays, computational pixels, 3D stacked SPAD sensor

17:00 - 17:30 - Coffee break

17:30 - 18:30 - Topic 2 - Vision
17:30 WS-02-13

ASPIDES - lessons leaned on strategy and funding (#3419)

L. Ratti1

1 Universita di Pavia, Dipartimento di Ingegneria Industriale e dell'Informazione, Pavia, Italy

Abstract

Please complete

Keywords: digital SiPM, SPAD
17:45 WS-02-14

PLATON - lessons leaned on strategy and funding (#3420)

D. Sgalaberna1

1 ETH Zürich, Inst. f. Teilchen- und Astrophysik, Zürich, Switzerland

Abstract

Please complete

Keywords: digital SiPM, SPAD
18:00 WS-02-15

SPADs in DRDs (#3421)

F. Retiere1

1 TRIUMF, Science Technology Department, Vancouver, British Columbia, Canada

Abstract

Please complete

Keywords: digital SiPM, SPAD
18:15 WS-02-16

Digital SiPM initiatives in the USA (#3422)

P. Rubinov1

1 Fermi National Accelerator Laboratory, Electrical Engineering Department, Batavia, United States of America

Abstract

Please complete

Keywords: digital SiPM, SPAD

18:30 - 18:45 - Topic 3 - Foundry perspective
18:30 WS-02-17

Foundry perspective at Fraunhofer IMS (#3423)

J. Ruskowski1

1 Fraunhofer Institute for Microelectronic Circuits and Systems, Duisburg, Germany

Abstract

Please complete

Keywords: digital SiPM, SPAD

18:45 - 19:30 - Topic 4 - How could one size fits all - A panel and group discussion
18:45 WS-02-18

Discussion/debate: on collaboration and funding strategies to bring these technologies to use
19:30 WS-02-19

Summary and conclusions
19:35 WS-02-20

Cocktail

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